Posts tagged with 'TeploTie'
Continuous product improvement results in quicker and easier install for the Ancon Teplo-Tie
Installation of Leviat’s Ancon Teplo-BF low-thermal conductivity wall ties is now quicker and easier following continuous product improvement and development. As a popular product in energy efficient construction, the reduction in material wastage is an added benefit. Read more
What are low thermal conductivity wall ties?
Ancon Teplo wall ties comprise pultruded basalt fibres set in a resin matrix which offers a thermal conductivity of just 0.7W/mK. The thermal efficiency of this innovative material means these ties are excluded from U-value calculations to BS EN ISO 6946, minimising insulation thickness and wall footprint. Read more
What is a thermal bridge? How can thermal bridging be minimised?
Energy efficiency is becoming increasingly important in today’s building designs and the thermal performance of the insulated building envelope is a key design consideration. Read more
Low Thermal Conductivity Cavity Wall Ties
Wall Ties are an essential element in the strength and stability of cavity walls, but by crossing the cavity they act as a thermal bridge between the internal and external leaves. Generally speaking, the wider the insulated cavity, the more substantial the Wall Tie needs to be and the greater the effect the tie will then have on the U-value of the wall. Read more
Latest News
Leviat sponsors bear in ‘suppawt’ of the Children’s Hospital Charity
We are delighted to announce that we will be sponsoring a Bear for the 2021 ‘Bears of Sheffield’ sculpture trail, a unique participative public art event that will raise funds for a new, urgently needed, Cancer and Leukaemia ward at Sheffield Children’s Hospital.
Leviat launch revolutionary new thermally efficient Ancon windpost
Designed to minimise thermal bridging in masonry cavity walls, the patented Ancon Thermal Windpost (TWP2) from Leviat offers up to an impressive 70% reduction in thermal transmission through the span of the windpost.