Posts tagged with 'TeploTie'
What are low thermal conductivity wall ties?
Ancon Teplo wall ties comprise pultruded basalt fibres set in a resin matrix which offers a thermal conductivity of just 0.7W/mK. The thermal efficiency of this innovative material means these ties are excluded from U-value calculations to BS EN ISO 6946, minimising insulation thickness and wall footprint. Read more
What is a thermal bridge? How can thermal bridging be minimised?
Energy efficiency is becoming increasingly important in today’s building designs and the thermal performance of the insulated building envelope is a key design consideration. Read more
Low Thermal Conductivity Cavity Wall Ties
Wall Ties are an essential element in the strength and stability of cavity walls, but by crossing the cavity they act as a thermal bridge between the internal and external leaves. Generally speaking, the wider the insulated cavity, the more substantial the Wall Tie needs to be and the greater the effect the tie will then have on the U-value of the wall. Read more
Latest News
Ancon to exhibit at Futurebuild 2019
Ancon will be exhibiting at Futurebuild 2019 from 5th - 7th March at ExCeL, London. Ancon will be on stand C82.
Peter McDermott appointed as Ancon Group Managing Director
Ancon is pleased to announce the appointment of Peter McDermott as Group Managing Director, effective 1st January 2019 following the retirement of Stuart Maxwell.